W66AP6NBQAHJ Memory_Electronic components_ Integrated circuit IC_ Semiconductor components_ Equipment procurement_ EIS LIMITED

Part number：

Product classification：

Manufacturer：

Type：

Encapsulation：

Packing：

Quantity：

RoHS status：

W66AP6NBQAHJ

Memory

Winbond Electronics Corporation

1GB LPDDR4, X16, 2133MHZ, -40C~1

Tray

Price:

$5.5890

Total number

Quantity

Price

Total price

$5.5890

$5.0220

$50.2200

$4.7430

$118.5750

$4.1130

$329.0400

230

$3.8970

$896.3100

440

$3.5010

$1,540.4400

945

$2.9520

$2,789.6400

2400

$2.8080

$6,739.2000

Obtain quotation information

product details

W66AP6NBQAHJ

Part number：

Product classification：

Manufacturer：

Type：

Encapsulation：

Packing：

Quantity：

RoHS status：

Specification sheet：

W66AP6NBQAHJ

Memory

Winbond Electronics Corporation

1GB LPDDR4, X16

Memory

Tray

Product parameters

PDF(1)

TYPE	DESCRIPTION
Mfr	Winbond Electronics Corporation
Series	-
Package	Tray
Product Status	ACTIVE
Package / Case	200-TFBGA
Mounting Type	Surface Mount
Memory Size	1Gbit
Memory Type	Volatile
Operating Temperature	-40°C ~ 105°C (TC)
Voltage - Supply	1.06V ~ 1.17V, 1.7V ~ 1.95V
Technology	SDRAM - Mobile LPDDR4
Clock Frequency	2.133 GHz
Memory Format	DRAM
Supplier Device Package	200-TFBGA (10x14.5)
Write Cycle Time - Word, Page	18ns
Memory Interface	LVSTL_11
Access Time	3.6 ns
Memory Organization	64M x 16

Online service

Online service

Online service