XCVC1502-2MLINSVG1369 System On Chip (SoC)_Electronic components_ Integrated circuit IC_ Semiconductor components_ Equipment procurement_ EIS LIMITED

Part number：

Product classification：

Manufacturer：

Type：

Encapsulation：

Packing：

Quantity：

RoHS status：

XCVC1502-2MLINSVG1369

System On Chip (SoC)

Xilinx (AMD)

IC VERSAL AI-CORE FPGA 1369BGA

Tray

Price:

$23,402.2500

Total number

Quantity

Price

Total price

$23,402.2500

Obtain quotation information

product details

XCVC1502-2MLINSVG1369

Part number：

Product classification：

Manufacturer：

Type：

Encapsulation：

Packing：

Quantity：

RoHS status：

Specification sheet：

XCVC1502-2MLINSVG1369

System On Chip (SoC)

Xilinx (AMD)

IC VERSAL AI-CO

System On Chip (SoC)

Tray

Specification sheet

Product parameters

PDF(1)

TYPE	DESCRIPTION
Mfr	Xilinx (AMD)
Series	Versal™ AI Core
Package	Tray
Product Status	ACTIVE
Package / Case	1369-BFBGA, FCBGA
Speed	600MHz, 1.4GHz
RAM Size	256KB
Number of I/O	478
Operating Temperature	-40°C ~ 110°C (TJ)
Core Processor	Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes	Versal™ AI Core FPGA, 800k Logic Cells
Connectivity	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals	DDR, DMA, PCIe
Supplier Device Package	1369-FCBGA (35x35)
Architecture	MPU, FPGA

Online service

Service hours: Monday to Saturday 9:00-18:00

+86-13723477211

Online service

Service hours: Monday to Saturday 9:00-18:00

Please select online customer service:

sales@fuchaoic.com

Online service

Service hours: Monday to Saturday 9:00-18:00

Please select online customer service: